Experience our innovations bigHead® Lean Bonding® and MultiMaterial-Welding™ at JEC Forum Chicago





Bossard will present several innovations at JEC Forum Chicago (booth 216).

bigHead® Lean Bonding®: This new fastening method is ideal for applications with lightweight composites and thin metal materials that cannot be welded, riveted or stapled. A pre-applied adhesive film on the fasteners guarantees automated, lean and fast processing.

MultiMaterial-Welding™ (MM-W): Thermoplastic fastening elements are melted into porous materials in fractions of a second using ultrasonic energy - for permanently friction-locked and positive connections in lightweight construction and sandwich materials.

In addition to bonding and fusing, special rivets such as ecosyn-BCT® and threaded inserts as well as screws with special threads for composite materials will also be on display. All these processes and products allow processing in seconds and are ideal for automated manufacturing environments.

JEC Group is the world’s leading company dedicated entirely to the development of information and business connections channels and platforms supporting the growth and promotion of the composite materials industry. Bossard will be exhibiting modern joining technologies for sandwich and lightweight materials as well as thin metals at booth 216 on June 19 and 20.

Aon Grand Ballroom at Navy Pier
5840 East Grand Avenue
Chicago, IL 60611

June 19, 2019
8:00 am - 6:15 pm

June 20, 2019
8:00 am - 5:00 pm

https://www.jec-chicago.events/

 

 

 

For the purpose of providing services, this website uses cookies. You will consent to this by clicking on “OK” and/or using our services.
Please click on privacy policy to find the information on cookies and the possibilities for modifying the terms of their storage.